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Semiconductor Research Corporation Announces 2024 Call for Research, $13 8M in Funding Opportunities

Semiconductor Research Corporation Announces 2024 Call for Research, $13 8M in Funding Opportunities
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United statesJennifer dickensNational advanced packaging manufacturing programSemiconductor research corporationDecadal plan for semiconductorsHeterogeneous integration research in packaging aprManufacturing united states instituteUnited states instituteNational semiconductor technology centerResearch corporationNanomanufacturing materialsHeterogeneous integration researchHardware securityComputer aided designAdvanced packaging technologiesStates institute

Semiconductor Research Corp unveils 2024 Research Call, $13 8M Funding

DURHAM, NC, April 10, 2024 Semiconductor Research Corporation (SRC), a premier research and workforce development consortium, is announcing the start of solicitation season with $13.8 million in funding opportunities. Calls for research will begin in early April and will run through June.

United statesSemiconductor research corporationUnited states instituteManufacturing united states instituteNational advanced packaging manufacturing programHeterogenous integration research in packaging aprDecadal plan for semiconductorsNational semiconductor technology centerNanomanufacturing materialsHeterogenous integration researchHardware securityComputer aided designAdvanced packaging technologiesStates instituteDecadal planResearch corporation

Semiconductor Research Corporation Announces 2024 Call for Research, $13 8M in Funding Opportunities

Semiconductor Research Corporation Announces 2024 Call for Research, $13 8M in Funding Opportunities
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United statesSemiconductor research corporationNational advanced packaging manufacturing programManufacturing united states instituteCall for researchUnited states instituteHeterogeneous integration research in packaging aprNational semiconductor technology centerDecadal plan for semiconductorsResearch corporation announcesResearch corporationNanomanufacturing materialsHeterogeneous integration researchHardware securityComputer aided designAdvanced packaging technologies

New Microelectronics and Advanced Packaging Roadmap Guides U S Electronics Ecosystem · EMSNow

New Microelectronics and Advanced Packaging Roadmap Guides U S Electronics Ecosystem · EMSNow
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United statesMatt kellyVictor zhirnovTodd younkinRoadmap extended executive committeeDecadal plan for semiconductorsUs department of commerceSemiconductor research corporationSemiconductor industry associationExtended executive committeeAdvanced packaging technologiesDecadal planScience act

The MAPT Roadmap - A Plan to Revitalize the Semiconductor Industry for Decades to Come

The MAPT Roadmap - A Plan to Revitalize the Semiconductor Industry for Decades to Come
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Todd younkinVictor zhirnovSemiconductor research corporationDecadal plan for semiconductorsSemiconductor industry associationUs department of commerceSemiconductor industryResearch corporationAdvanced packagingDecadal planNational instituteBusiness wireScience actSemiconductor research