Posted : 2021-03-07 11:55
Updated : 2021-03-08 10:44
Nepes Chairman Lee Byung-koo speaks during an interview with The Korea Times at the company s headquarters in southern Seoul, March 2. / Korea Times photo by Choi Won-suk
By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world s first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.