Posted : 2021-03-07 11:55
Updated : 2021-03-08 10:44
Nepes Chairman Lee Byung-koo speaks during an interview with The Korea Times at the company s headquarters in southern Seoul, March 2. / Korea Times photo by Choi Won-suk
By Kim Bo-eun
Nepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.
It became the first local company to commercialize fan-out wafer level packaging and also became the world s first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.
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NEPES Brings in Former President Chung Chil-Hee of Samsung Advanced Institute of Technology as the New Chairman
NEPES has brought in Chung Chil-hee, who used to work as an advisor and the president of Samsung Advanced Institute of Technology (SAIT) successively, to be the new chairman of the company.
According to the industry, NEPES has appointed Chung Chil-hee, who used to work as an advisor at Samsung Electronics, as the new chairman.
A representative for NEPES explained that Chairman Chung is overseeing the company’s semiconductor business.
Chairman Chung is one of main leaders who are responsible for making Samsung Electronics’ semiconductor business what it is today. Since joining the company in 1979, he had held different positions. When he became the president of SAIT, he was responsible for development of Samsung Electronics’ future technologies such as quantum dot and neural processing. In addition to holding the president position of SAIT, he had also h