Hsinchu, Taiwan – March 10, 2022 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC 2.5D and 3D Advanced Packaging Technology (APT). The platform supports TSMC's CoWoS-S, CoWoS-R, and InFO technologies. GUC provides a total…
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles and for low risk, high yield production of ASICs adopting TSMC 2.5D and 3D Advanced Packaging Technology (APT).
GUC Announces Industry Highest Bandwidth and Power Efficient Die-to-Die (GLink 2 0) Total Solution design-reuse.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from design-reuse.com Daily Mail and Mail on Sunday newspapers.