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Rising Demand, chiplet and 3DIC trends offer bright outlook for CHPT

In a media debrief following the shareholder meeting, Huang Shui-Ke, president of Chunghwa Precision Test (CHPT), outlined the company s struggle in the previous year. The first quarter of 2023 was particularly challenging, resulting in minor losses. However, the firm is on track to attain a break-even point in the second quarter, with a potential profit margin surfacing, according to Huang.

ASE intros FOCoS-Bridge for AI and HPC chips

Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm package containing two ASICs and eight HBM devices connected by eight silicon bridges.

AMD Introduces AMD Radeon PRO W7000 Series Graphics Cards

Chiplet getting trendy but SMIC misses out on opportunities

Semiconductor Manufacturing International Corp. (SMIC), the leading chip foundry company in China, is missing out on the opportunity brought by chiplet technologies, as Beijing Municipal Government specifically named chiplet technology as the primary investment target for achieving advanced chip manufacturing technology breakthroughs.

JCET gearing up for automotive, chiplet demand boom

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, is gearing up for a surge in demand for automotive and chiplet solutions with its expanding system- and wafer-level, and 2.5D/3D advanced packaging technology portfolio.

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