[another wafer faucet has launched an offensive on the third-generation semiconductor industry chain "must compete". According to Taiwan media reports today, Liandian has cut into the third-generation semiconductor field through investment in Lianying. UMC plans to start with 6-inch gallium nitride (GaN) products, followed by the layout of silicon carbide (SiC), and the development of 8-inch wafers. The company revealed that the third-generation semiconductor process will be converted from CMOS and will be waiting for an opportunity to expand production in the future.