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Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs


December 17, 2020
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs
Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications
SAN JOSE, Calif., December 16, 2020 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI™) advanced packaging reference flow. This proven on-/off-chip design flow, which features Cadence multi-physics system analysis tools including the Celsius™ Thermal Solver and Clarity™ 3D Solver, accelerates the planning, implementation, verification and signoff of 2.5D and 3D multi-die chip designs employed in hyperscale computing, 5G communications and automotive applications, particularly those utilizing artificial intelligence (AI ....

Ben Gu , Sangyun Kim , Sigrity System , Cadence Design Systems Inc , Group At Cadence , Companies To Work , Foundry Design Technology Team At Samsung Electronics , Cadence Design Systems , Samsung Foundry , Samsung Multi Die Integration , Thermal Solver , Celsius Thermal Solver , Integrity Solution , Package Designer Plus , Implementation System , Interconnect Designer , Verification System , Foundry Design Technology Team , Intelligent System Design , பென் கு , கேடென்ஸ் வடிவமைப்பு அமைப்புகள் இன்க் , குழு இல் கேடென்ஸ் , நிறுவனங்கள் க்கு வேலை , ஃபவுண்டரி வடிவமைப்பு தொழில்நுட்பம் அணி இல் சாம்சங் மின்னணுவியல் , கேடென்ஸ் வடிவமைப்பு அமைப்புகள் , சாம்சங் ஃபவுண்டரி ,