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Growth Drivers Increasing Power Consumption and Shrinking Size of Devices Market Challenges Delays in Spectrum Allocation and Deployment of Small Cells Expected to Impact the Demand for Thermal Interface Materials for 5G Physical Properties of Traditional Thermal Interface Materials Market Opportunities Countries at a Nascent Stage of 5G Roll-Out Expected to Introduce Growth Opportunities for 5G TIM Manufacturers Impact of Thermal Interface Material Dielectric Constant on EMI Radiation Key Companies Profiled Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, Dow, W.L. Gore & Associates, Inc., Panasonic Corporation, Jiangxi Dasen Technology Co., Ltd., 3M Company, Shin-Etsu Chemical Co., Ltd., Denka Company Limited, JONES TECH PLC, T-Global Technology Co., Ltd., Parker Hannifin Corp, Momentive Performance Materials, Inc., Dongguan Sheen Electronic Technology Co., Ltd.

Ulsan gwangyoksiSouth koreaUnited statesLaura woodMomentive performance materials incChain networkHenkel corporationProperties of traditional thermal interface materialsProduct developmentJiangxi dasen technology co ltdG technologyFuji polymer industries co ltdStrengths of the companyCompetitive benchmarking company profilesDongguan sheen electronic technology co ltdPanasonic corporation