26 May 2021, 01:05 am
AMD gets mixed in on the recent leak involving its EPYC chip that will be getting a new 3D die stacking technology feature. According to the GPU leakers, the company is now embracing a group of new-age processors that will be centered on the Milan-X series variant.
AMD Rumors Circling EPYC Milan-X Processor
(Photo : Timothy Dykes from Unsplash)
AMD EPYC Milan-X is believed to feature a new 3D die technology.
According to the latest report of Tom s Hardware on Wednesday, May 26, Patrick Schur and ExecutableFix tweeted that AMD is now getting a headstart on its preparation for the release of its new data center processors.
17 May 2021, 12:05 am
AMD is going full-blast with the Zen architecture, and it s not just their Ryzen chips that are getting a massive boost come Zen 4. Case in point, their new line of EPYC processors are going to be even more. epic (pun totally intended).
TweakTown reports that a certain AMD roadmap for Zen 4 was just recently leaked, and it showed very interesting tidbits for the next-generation EPYC server CPUs. Namely, the 7004 series will be featuring a monstrous 96 cores and 192 threads. That s frankly insane.
(Photo : TweakTown )
Based on the very efficient 5nm process by TSMC, these Genoa EPYC CPUs are slated to be among the most powerful chips made for this generation. And the IPC improvement from previous gen is extremely significant: according to a report by WCCFTech, there s a projected 29% IPC increase, as well as a 40% overall performance improvement.