Chipmaker AMD is set to unveil a new array of X3D MCM processors in its third-generation EPYC Milan CPU server stack, which would be unprecedented in its roadmap.
26 May 2021, 01:05 am
AMD gets mixed in on the recent leak involving its EPYC chip that will be getting a new 3D die stacking technology feature. According to the GPU leakers, the company is now embracing a group of new-age processors that will be centered on the Milan-X series variant.
AMD Rumors Circling EPYC Milan-X Processor
(Photo : Timothy Dykes from Unsplash)
AMD EPYC Milan-X is believed to feature a new 3D die technology.
According to the latest report of Tom s Hardware on Wednesday, May 26, Patrick Schur and ExecutableFix tweeted that AMD is now getting a headstart on its preparation for the release of its new data center processors.