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/PRNewswire/ The global diesel exhaust fluid market size is expected to grow by USD 14.94 billion, progressing at a CAGR of almost 14% during the forecast. ....
Share this article Share this article NEW YORK, May 20, 2021 /PRNewswire/ Set to grow by USD 39.81 billion during 2021-2025, Technavio s latest market research report estimates the agrochemicals market to register a CAGR of over 4%. The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. Technavio has announced its latest market research report titled Agrochemicals Market by Product and Geography - Forecast and Analysis 2021-2025 The market is fragmented, and the degree of fragmentation will accelerate during the forecast period. Archer Daniels Midland Co., BASF SE, Bayer AG, Cargill Inc., CF Industries Holdings Inc., Corteva Inc., Evonik Industries AG, Nissan Chemical Corp., Nutrien Ltd., and Yara International ASA are some of the major market participants. The increasing use of herbicides will offer immense growth opportunities. To leverage the current opportunities, ....
MEA To learn more about the global trends impacting the future of market research, download a free sample:https://www.technavio.com/talk-to-us?report=IRTNTR40986 Agrochemicals Market 2021-2025: Vendor Analysis and Scope To help businesses improve their market position, the agrochemicals market provides a detailed analysis of around 25 vendors operating in the market. Some of these vendors include Archer Daniels Midland Co., BASF SE, Bayer AG, Cargill Inc., CF Industries Holdings Inc., Corteva Inc., Evonik Industries AG, Nissan Chemical Corp., Nutrien Ltd., and Yara International ASA. The report also covers the following areas: Agrochemicals Market size Agrochemicals Market industry analysis ....
DSA patterns line pitches down to 18nm Imec has demonstrated the capability of directed self-assembly (DSA) to pattern line/spaces with a pitch as small as 18nm, using a high-chi block copolymer (high-χ BCP) based process under high volume manufacturing (HVM) conditions. An optimized dry-etch chemistry was used to successfully transfer the pattern into an underlying thick SiN layer – which will enable further defectivity inspection. These results confirm the potential of DSA to complement traditional top-down patterning for the industrial fabrication of sub-2nm technology nodes. The further miniaturization of devices will require the patterning of features that have critical pitches below 20nm. For these small feature sizes, the traditional top-down lithography patterning is increasingly challenged with issues that are inherent to the reaction of the photosensitive materials with light – such as stochastic printing failures and line-edge/line-width roughness (LER ....