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Samsung 3nm nanosheet transistor advantages described - Industry - News

It is expected that today s popular FinFET transistor design will give way to stacked nanosheet transistors in the coming years – for various design and technology reasons. TSMC plans to stick with FinFET for 3nm, but Samsung is bravely / dangerously forging ahead with plans for a transition to nanosheet transistors with its 3nm nodes, reports IEEE Spectrum.
Samsung Electronics vice president, Taejoong Song, presented at the IEEE International Solid-State Circuits Conference earlier this month and outlined some key advantages of nanosheet transistors. We have used FinFET transistors for about a decade, however at 3nm we are using a gate all around transistor, Song told the virtual audience. Going forward he and his team believe that nanosheet transistors will be a winning design as they provide high speed, low power, and small area. ....

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Polymer cables could replace Thunderbolt & USB, deliver more than twice the speed - Future Apple Hardware Discussions on AppleInsider Forums

Researchers are working on a cabling system that could provide data transfer speeds multiple times faster than existing USB connections using an extremely thin polymer cable, in a system that echoes the design path of Thunderbolt.
An Apple Thunderbolt 3 Pro cable
Presented at the February IEEE International Solid-State Circuits Conference, the research aims to develop a connection type that offers far better connectivity than current methods. In part, it aims to accomplish this by replacing copper wiring with something else.
Copper is typically used for wires like USB and HDMI to handle data transfers, but it requires a lot of power to work for high levels of data transmission. There s a fundamental tradeoff between the amount of energy burned and the rate of information exchanged, said MIT alumni and lead author Jack Holloway. ....

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Polymer cables could replace Thunderbolt & USB, deliver more than twice the speed

Researchers are working on a cabling system that could provide data transfer speeds multiple times faster than existing USB connections using an extremely thin polymer cable, in a system that echoes the design path of Thunderbolt.
Presented at the February IEEE International Solid-State Circuits Conference, the research aims to develop a connection type that offers far better connectivity than current methods. In part, it aims to accomplish this by replacing copper wiring with something else.
Copper is typically used for wires like USB and HDMI to handle data transfers, but it requires a lot of power to work for high levels of data transmission. There s a fundamental tradeoff between the amount of energy burned and the rate of information exchanged, said MIT alumni and lead author Jack Holloway. ....

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Samsung Puts Intelligence into High-Bandwidth Memory

Samsung, more widely known for making television monitors, smartphones and other popular consumer devices, also is a world leader in producing computer memory. The North Korean IT giant announced that it has developed the industry’s first high-bandwidth memory (HBM) chip that’s integrated with artificial intelligence processing power the HBM-PIM.
Like Intel, AMD, NVIDIA and others are baking security, networking and other functionality into processors, Samsung is doing the same, only with AI. The new processing-in-memory (PIM) architecture brings real-time AI computing capabilities inside high-performance memory so as to accelerate large-scale processing in data centers, high performance computing (HPC) systems and AI-enabled mobile applications. ....

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Novel, faster data transfer system developed

New York: Researchers have developed a data transfer system that can transmit information 10 times faster than a USB. The new link pairs ....

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