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Ethernity Networks Releases ENET Wireless Backhaul Solution with Integrated Wireless Bonding USA - English Share this article Share this article LOD, Israel, May 10, 2021 /PRNewswire/ Ethernity Networks (AIM: ENET.L), a leading supplier of data processing offload solutions on programmable hardware for accelerating telco/cloud networks, today announced it has released the ENET Wireless Backhaul solution, designed for standalone FPGA-based appliances. The solution combines up to 60Gbps of networking capacity with newly patented bonding technology for optimizing 4G and 5G network deployments. The ENET Wireless Backhaul solution utilizes Ethernity s ENET Flow Processor FPGA firmware coupled with Ethernity s newly patented bonding technology to run on an FPGA appliance. The integrated bonding technology evenly distributes wireless traffic over multiple 1GbE and 10GbE ports. It offers the ability to support fragmentation, reassembly, and reordering of packets ....