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MacDermid Alpha Opens New Die Attach Applications Center in Taiwan MacDermid Alpha Electronics Solutions, a global leader in high performance electronics materials, officially opened a Greater China Die Attach Application Center on April 1, 2021. The advanced technology and application center will house technical service and lab personnel, equipped with state-of-the-art die attach assembly and process equipment. Rick Frick, Vice President and General Manager of the Semiconductor Solutions division, described the new facility and its impact, “With MacDermid Alpha’s unique role as a leading packaging materials supplier to all steps of the electronics manufacturing supply chain, this multi million dollar investment to build a leading edge application’s center is an important next step in enabling our customers to meet their design goals. With these new capabilities, we will foster not only local, but al ....
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