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OPTIGA Connect IoT from Infineon Featured in THE EDGE by Future Electronics

OPTIGA Connect IoT from Infineon Featured in THE EDGE by Future Electronics
Future Electronics is featuring Infineon’s OPTIGA Connect IoT OC2321 eSIM solution in this month’s edition of THE EDGE.
Pointe Claire, Quebec, Canada, July 17, 2021 (PR.com) Future Electronics, a global leading distributor of electronic components, is featuring a turnkey eSIM solution for cellular-connected IoT devices from Infineon in the latest edition of THE EDGE.
The Infineon OPTIGA Connect IoT is a ready-to-connect embedded SIM (eSIM) solution for cellular IoT devices. This turnkey solution allows easy, secured and cost-optimized deployment and management of cellular-enabled IoT devices at scale. The OC2321 comes with a pre-installed GSMA-compliant operating system and pre-integrated connectivity capabilities. OPTIGA Connect IoT offers global cellular network coverage (2G, 3G, 4G, CATM and other LTE services) spanning 640+ networks across 200 countries. ....

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iTWire - Renesas' Modular IoT Development Platform reduces time-to-market and design complexity

Renesas’ Modular IoT Development Platform reduces time-to-market and design complexity
Friday, 09 July 2021 12:46
Renesas’ Modular IoT Development Platform reduces time-to-market and design complexity
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Renesas a supplier of semiconductor solutions, introduced a new IoT system design platform that eases the prototyping of IoT systems.
The Renesas Quick-Connect IoT system consists of standardised boards and interfaces, enabling designers to quickly and easily connect a wide range of sensors to MCU development boards. The new system also delivers core software building blocks that are portable between boards, greatly reducing coding requirements.
Renesas senior director of the systems and solutions team DK Singh said, “We are laser focused on delivering solutions that enable customers to get to market faster with superior end products. ....

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Renesas' New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity – EEJournal

Renesas' New Modular IoT Development Platform Dramatically Reduces Time-to-Market and Design Complexity – EEJournal
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AES Ohio Selects Landis+Gyr for Next Generation AMI and Grid Edge Technology Deployment

AES Ohio Selects Landis+Gyr for Next Generation AMI and Grid Edge Technology Deployment
apnews.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from apnews.com Daily Mail and Mail on Sunday newspapers.

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SIMCom, together with Infineon and Kigen, has innovated with the smallest eSIM-enabled module bringing new possibilities for space-constrained cellular IoT

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Highlights
The SIM7070 series from SIMCom is an NB-IoT module in a compact footprint (24 mm x 24 mm) combining GSMA-compliant eSIM remote management from Kigen with a best-in-class eSIM security controller from Infineon optimized for space-constrained and industrial applications.
SIMCom, Kigen and Infineon have announced the module s immediate availability, even as a first in Europe.
The single certified eSIM-enabled product allows OEMs and MVNOs to ease manufacture and logistics for the acceleration of massive IoT so as to quickly scale to millions of devices in the field, regardless of location.
SHANGHAI, June 28, 2021 /PRNewswire/ SIMCom, the leading designer and manufacturer of Machine-to-Machine (M2M) wireless modules and solutions, announced that the SIMCom NB-IoT SIM7070 module measuring only 24 mm x 24 mm can now be equipped with a compact eSIM security controller from Infineon powered by GSMA-compliant remote SIM management s ....

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