High-Density eMRAM Compiler TSMC 22ULL IP Core design-reuse.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from design-reuse.com Daily Mail and Mail on Sunday newspapers.
M31 today announced that Jayanta, VP of Technical Marketing of M31 Technology, presented a speech on "Driving AIoT Innovation - M31 Low-Power IP" at the TSMC North America 2023 Open Innovation Platform® (OIP) Ecosystem Forum, showcasing M31's low-power silicon intelligence (IP) solution on TSMC's N12e process.
First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies q8dailynews.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from q8dailynews.com Daily Mail and Mail on Sunday newspapers.
The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The