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Low-pressure, thin bond line thermal interface material (TIM) from Henkel brings best-in-class thermal management solution for next-gen ICs

Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel announced the commercial availability of Bergquist Hi Flow THF 5000UT. The phase change film TIM marks a significant milestone in thermal management materials development, allowing for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface. This is critical for challenging package designs with complex architectures, such as lidless multi-chip devices used in high-. ....

Wayne Eng , Bergquist Hi Flow , Henkel Data , Telecom Global Head , Market Strategy , Press Release Image , Ultra Thin , Ulti Chip , Press Release , Ews Release ,

Stock Market | FinancialContent Business Page

Stock Market | FinancialContent Business Page
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Creighton Vance , Kaiser Permanente , Telecom At Snowflake , Goldman Sachs , Hydrogen Torch , Telecom Global Head Of Industry , Telecom Data Cloud , Commonwealth Bank , Global Communications Team , Procter Gamble , Snowflake Telecom Data Cloud , Wells Fargo , Data Cloud , Phil Kippen , Telecom Global Head , Sri Ambati ,

Henkel Thermal Interface Material

Henkel has announced the commercialization of its latest gel thermal interface material, Bergquist Liqui Form TLF 10000. ....

Wayne Eng , James Edmondson , Idtechex Senior Technology Analyst , Henkel Data , Telecom Global Head , Market Strategy ,