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Addressing Multi-Physics Effects for High-Performing Multi-Die Systems with Integrated Die/Package Co-Design Platform

What are typically second- or third-order effects in 2D chip designs are elevated into primary effects in multi-die systems. It’s no wonder, given the .

System technology coSystem technology co optimizationMulti die system successMulti die systems integrated package co design platformYnopsys blogY kenneth larsenHekhar kapoor synopsys

Intel Shows New Stacked CFET Transistor Design At ITF World

Intel’s Ann Kelleher showed a render of the new Complementary FET (CFET) transistor during her presentation at imec’s ITF World conference.

Ann kelleherApplied materialsInteruniversity microelectronics centreIntel technology developmentSystem technology coTechnology developmentSystem technology co optimization

IEDM 2021 Tutorials and Short Courses

While the comprehensive technical program for the 2021 IEEE International Electron Devices Meeting (IEDM) will be finalized in the fall, the popular IEDM T

United statesWei luBenjamin colombeauHoi jun yooHubregt visserVictor morozJeehwan kimJohn paul strachanRoy koretDechao guoGiacomo indiveriAsen asenovDong seup leeRobert clarkKai zhaoHuaqiang wu

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