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Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
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Sanjay Bali , Dan Kochpatcharin , Synopsys Inc , Group At Synopsys , Design Infrastructure Management Division , Synopsys Multi Die System , Universal Chiplet Interconnect Express , Product Management , Synopsys Test ,

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Comprehensive Multi-Die System Design Solution Supports 3Dblox 2.0 Standard and TSMC 3DFabricTM Technologies to Boost Productivity for Fast Heterogeneous. ....

Sanjay Bali , Dan Kochpatcharin , Kelli Wheeler , Design Infrastructure Management Division , Synopsys Inc , Group At Synopsys , Silicon To Software , Prnewswire Synopsys Inc , Boost Productivity , Fast Heterogeneous , Synopsys Multi Die System , Universal Chiplet Interconnect Express , Product Management , Synopsys Test ,