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TESCAN Announces New Delayering Capability for Unattended, Automated Failure Analysis


TESCAN Announces New Delayering Capability for Unattended, Automated Failure Analysis
TESCAN ORSAY HOLDING a.s. announces the release of the new TESCAN Delayering module that enables automated gas-assisted top-down delayering using TESCAN SOLARIS X and AMBER X Plasma focused ion beam (FIB) instruments. TESCAN Delayering supports physical failure analysis through the combination of inert Xe plasma FIB ions and unique, proprietary gas chemistries that have been developed specifically for today’s advanced technology nodes, creating artifact-free, site-specific trenches with maximum planarity and homogeneity and without altering a device’s electrical properties for rapid access to deeply buried features or defects. ....

United States , United States Inc , Semiconductor Market Segment , States Inc May , Product Manager , ஒன்றுபட்டது மாநிலங்களில் , ஒன்றுபட்டது மாநிலங்களில் இன்க் , குறைக்கடத்தி சந்தை பிரிவு , மாநிலங்களில் இன்க் இருக்கலாம் , ப்ராடக்ட் மேலாளர் ,