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SHENMAO Debuts Special Solder Paste for AI Substrate Power Management Modules

SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a significant advancement in thermal fatigue reliability and performance. ....

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ASE Holdings Hosts Annual Supplier Day to Recognize Outstanding Suppliers of 2022

ASE Holdings Hosts Annual Supplier Day to Recognize Outstanding Suppliers of 2022
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High Thermal Impact Reliability Water-Soluble Solder Paste from SHENMAO

SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. ....

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