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Applied Materials Advances Heterogeneous Chip Integration with New Technologies for Hybrid Bonding and Through-Silicon Vias

New materials and systems enable chipmakers to increase the performance and reliability of hybrid bonding, the industry’s most advanced interconnect technologyNew deposition systems improve the. ....

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Applied Materials to invest $400 million in new Indian engineering ...

Applied Materials plans to build a collaborative engineering centre in Bangalore, India focused on developing and commercialising technologies for semiconductor manufacturing equipment. ....

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Applied Materials to Establish Collaborative Engineering Center in India

Applied Materials to Establish Collaborative Engineering Center in India
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India-US bolster partnership to drive innovation in Semiconductors, 5G/6G, AI and more

India-US bolster partnership to drive innovation in Semiconductors, 5G/6G, AI and more
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Applied Materials To Build Engineering Centre in India: US-Based Semiconductor Company To Invest USD 400 Million

Applied Materials To Build Engineering Centre in India: US-Based Semiconductor Company To Invest USD 400 Million
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