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Deploying Chiplets into Mass Markets

Chiplets are being universally used in highest performance SOC, ASICs and ASSP devices by large integrated Semiconductor companies to reduce costs and increase yields. However, we have not seen the expected rapid deployment of standardized Chiplet building blocks that designers can simply buy and deploy cost effectively, much faster than developing a traditional SOC.In this paper we review key roadblocks to rapid adoption and provide five detailed suggestions to overcome barriers. ....

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Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030

Global 3D IC and 2.5D IC Packaging Market to Reach $6.4 Billion by 2030. In the changed post COVID-19 business landscape, the global market for 3D IC and 2.5D IC Packaging estimated at US$3.3 Billion in the year 2022, is projected to reach a revised size of US$6.4 Billion by 2030, growing at a CAGR of 8.7% over the analysis period 2022-2030.New York, July 03, 2023 (GLOBE NEWSWIRE) Reportlinker.com announces the release of the report "Global 3D IC and 2.5D IC Packaging Industry" - https://www. ....

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The Underfill Materials Market Report (2020-2027): Opportunities, Challenges, Strategies, Forecasts – KSU

The Underfill Materials Market Report (2020-2027): Opportunities, Challenges, Strategies, Forecasts – KSU
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