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JY 귀환 앞두고…이번엔 '패키징' 기술로 도발한 美인텔

삼성전자와 반도체판 ‘왕좌의 게임’을 벌이는 미국 인텔이 10일 이번엔 패키징 기술 경쟁력을 강조하며 파운드리(반도체 수탁생산) 분야의 리더십을 공고히 할 것이라고 거듭 포부를 밝혔다. 지난달 기술전략 설명회에서 차세대 공정 기술 로드맵을 공개하며 “2025년까지 대. ....

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인텔, 삼성 고객사 퀄컴 칩 제조 계획 발표…삼성전자 영향은

인텔, 삼성 고객사 퀄컴 칩 제조 계획 발표…삼성전자 영향은
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United States , Samsung Electronics , Manufacturing Planning , Roadmap Public , Qualcomm Amazon New , March Strategy , ஒன்றுபட்டது மாநிலங்களில் , சாம்சங் மின்னணுவியல் , உற்பத்தி திட்டமிடல் ,