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proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023

proteanTecs to Showcase the Future of Health and Performance Monitoring at DAC and SEMICON West 2023
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United statesTamar naishlosElizabeth brownSemiconductor engineeringArchon design solutionsSemiconductor testingDesign panelRevolution of semiconductor designTest vision symposium panelGlobal unichip corporationBusiness wireCustomer demo meetingsInteractive demoBlind spotsReliability monitoringAlphawave semi

proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit

proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit
streetinsider.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from streetinsider.com Daily Mail and Mail on Sunday newspapers.

United statesMarc hutnerElizabeth brownNitza basocoChuck sobeyPanel sessionTecs press contactGlobal unichip corporationFierce electronicsCadence design systemsSan joseChiplet summitBusiness wireBoost chiplet designNir severChiplet design challenges

Stock Market | FinancialContent Business Page

Stock Market | FinancialContent Business Page
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United statesMarc hutnerNitza basocoChuck sobeyPanel sessionGlobal unichip corporationFierce electronicsCadence design systemsSan joseChiplet summitBusiness wireBoost chiplet designNir severChiplet design challengesHow industry canInterfaces track

GUC GLink™ Chip Leverages proteanTecs Die-to-Die Interconnect Monitoring

Results highlight how deep data performance and reliability monitoring delivers comprehensive visibility into high bandwidth interfaces

United statesEvelyn landmanIgor elkanovichTaiwan stock exchangeGlobal unichip corporationChiplet interconnect express consortiumSolutions toTest chip uses in monitoringDeep data analyticsHigh bandwidth die to characterizationCase studyReliability monitoringHeterogeneous packagingCombining deep dataMachine learning algorithmsNorth america

GUC GLink™ Chip Leverages proteanTecs Die-to-Die Interconnect Monitoring

/PRNewswire/ proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC.

United statesEvelyn landmanIgor elkanovichTaiwan stock exchangeGlobal unichip corporationChiplet interconnect express consortiumSolutions toTest chip uses in monitoringDeep data analyticsHigh bandwidth die to characterizationCase studyReliability monitoringHeterogeneous packagingCombining deep dataMachine learning algorithmsNorth america