Winbond s advanced memory solutions are revolutionizing the landscape for a smarter future. Their cutting-edge technology promises unparalleled efficiency and reliability, catering to diverse applications such as IoT, automotive, and AI. With a focus on innovation and sustainability, Winbond is driving the evolution of memory solutions towards a brighter tomorrow. https://x.com/winbondflash?s=11&t=AeRzygEEIHmjXRYY4hk-7A https://www.facebook.com/winbondcorp https://www.linkedin.com/company/winbond/ https://www.winbond.com/hq? locale=en
WIN SOURCE made its debut at embedded world Germany. In the interview, they discussed their role in the electronic supply chain, strategies for emerging technologies, and innovative supply chain management. This showcased their strength and professionalism in component procurement and management, ensuring a continuous industry-leading position and high-quality customer service. Video: Priya Atwal, emap http://www.twitter.com/win source…
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To optimize embedded and mobile applications for today’s IoT requirements, AAEON, a leading manufacturer of advanced hardware platforms for SDN, NFV, SD-WAN and white box uCPE solutions, today announced the launch of NanoCOM-TGU, a COM Express Type 10 Powered by the 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3).
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