TSMC s CoWoS, ASE Technology s FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Nvidia has announced the launch of a new class of large-memory AI supercomputer, the Nvidia DGX, powered by Nvidia s GH200 Grace Hopper superchips and the Nvidia NVLink Switch System, to enable the development of massive, next-generation models for generative AI language applications, recommender systems, and data analytics workloads.
Taiwan s leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips and modules for Broadcom, offering their CPO (co-packaged optics) backend services for the US chipmaker, according to industry sources.