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Announcement on 2023/10/11: UMC will convene Q3 2023 Investor Conference 99 2 Announcement on 2023/10/25 -October 25, 2023 at 06:07 am EDT

99.1 Announcement on 2023/10/11: UMC will convene Q3 2023 Investor Conference 99.2 Announcement on 2023/10/25: Announcement of board meeting approved the consolidated financial.

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Ansys semiconductor simulation tools certified for UMC WoW advanced packaging

Ansys semiconductor simulation tools certified for UMC WoW advanced packaging
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Ansys Semiconductor Simulation Solutions Certified for UMC s 3D Chip Technology

Ansys Semiconductor Simulation Solutions Certified for UMC s 3D Chip Technology
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UMC, Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

UMC, Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
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New Electronics - 3D-IC hybrid bonding reference flow collaboration

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies.

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