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Designing Chips with CHIPS: West Coast Pre-Silicon Summit to Convene Industry Leaders in San Diego

Designing Chips with CHIPS: West Coast Pre-Silicon Summit to Convene Industry Leaders in San Diego
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Oct 28 (Fri) @ 1:30pm: "Advanced Packaging: Chiplets, Dielets and Heterogeneous Integration," Subramanian S. Iyer, Prof. EE, UCLA | Electrical and Computer Engineering

Oct 28 (Fri) @ 1:30pm: "Advanced Packaging: Chiplets, Dielets and Heterogeneous Integration," Subramanian S. Iyer, Prof. EE, UCLA | Electrical and Computer Engineering
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