Oct 28 (Fri) @ 1:30pm: "Advanced Packaging: Chiplets, Dielets and Heterogeneous Integration," Subramanian S. Iyer, Prof. EE, UCLA | Electrical and Computer Engineering ucsb.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from ucsb.edu Daily Mail and Mail on Sunday newspapers.