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Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud

Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
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New Electronics - Microsoft selects Siemens for RAMP programme

Flex Logix Collaborating with Microsoft to Help Build Secure State-Of-The-Art Chips for US Department of Defense (DOD)

MOUNTAIN VIEW, Calif. – July 11, 2022 – Flex LogixÒ Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has been selected to be part of a team of microelectronic industry leaders, led by Microsoft, to build a chip development platform with the utmost regard for security as demonstrated by…

New Electronics - Flex Logix working with Microsoft to build secure chips

Flex Logix Technologies, a supplier of embedded FPGA (eFPGA) IP, architecture and software, has been selected to be part of a team of microelectronic companies, led by Microsoft, to build a chip development platform for security as demonstrated by the DoD RAMP Project.

New Electronics - Microsoft selects Cadence for RAMP Phase II Programme

New Electronics - Microsoft selects Cadence for RAMP Phase II Programme
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