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Integrating dimensions to get more out of Moore's Law and advance electronics

Integrating dimensions to get more out of Moore's Law and advance electronics
techxplore.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from techxplore.com Daily Mail and Mail on Sunday newspapers.

United States , Karim Sadaf , Saptarshi Das , Rahul Pendurthi , Najam Sakib , Charles Ying , Darsith Jayachandran , Us National Science Foundation , Dimensional Crystal Consortium , Penn State , Elizabeth Flores Gomez , Pennsylvania State University Materials Research , More Moore , More Than Moore , Muhtasim Ul Karim Sadaf , Two Dimensional Crystal Consortium , Science Foundation , Materials Innovation Platform ,

Maximizing Moore's Law for Advanced Electronics Integration

Maximizing Moore's Law for Advanced Electronics Integration
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Rahul Pendurthi , Thomas Mcknight , Ying Han , Karim Sadaf , Nicholas Trainor , Andrew Pannone , Charles Ying , Shalini Kumari , Army Research Office , Dimensional Crystal Consortium , Us National Science Foundation , More Than Moore , Muhtasim Ul Karim Sadaf , Penn State , Two Dimensional Crystal Consortium , Science Foundation , Materials Innovation Platform , Joan Redwing ,

Integrating dimensions to get more out of Moore's Law and advance electronics

Today s most advanced chips house nearly 50 billion transistors within a space no larger than your thumbnail. The task of cramming even more transistors into th ....

Nicholas Trainor , Ying Han , Charles Ying , Karim Sadaf , Saptarshi Das , Rahul Pendurthi , Shalini Kumari , Najam Sakib , Thomas Mcknight , Andrew Pannone , Darsith Jayachandran , Dimensional Crystal Consortium , Army Research Office , Us National Science Foundation , Penn State , More Moore , More Than Moore , Muhtasim Ul Karim Sadaf , Two Dimensional Crystal Consortium , Science Foundation , Materials Innovation Platform , Joan Redwing ,

Integrating dimensions to get more out of Moore's Law and advance electronics

Today s most advanced chips house nearly 50 billion transistors within a space no larger than your thumbnail. The task of cramming even more transistors into th ....

Andrew Pannone , Thomas Mcknight , Najam Sakib , Darsith Jayachandran , Charles Ying , Karim Sadaf , Nicholas Trainor , Ying Han , Shalini Kumari , Saptarshi Das , Rahul Pendurthi , Dimensional Crystal Consortium , Army Research Office , Us National Science Foundation , Penn State , More Moore , More Than Moore , Muhtasim Ul Karim Sadaf , Two Dimensional Crystal Consortium , Science Foundation , Materials Innovation Platform , Joan Redwing ,

Integrating dimensions to get more out of Moo

<p>In a study published today (Jan. 10) in the journal <a href="https://www.nature.com/articles/s41586-023-06860-5">Nature</a>, Saptarshi Das, an associate professor of engineering science and mechanics and co-corresponding author of the study, and his team suggest a way to fit more transistors on a chip by seamlessly implementing 3D integration with 2D materials.</p>
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Nicholas Trainor , Najam Sakib , Andrew Pannone , Saptarshi Das , Karim Sadaf , Shalini Kumari , Charles Ying , Thomas Mcknight , Rahul Pendurthi , Ying Han , Darsith Jayachandran , Method Of Research , Army Research Office , Us National Science Foundation , Dimensional Crystal Consortium , Penn State , More Moore , More Than Moore , Muhtasim Ul Karim Sadaf , Two Dimensional Crystal Consortium , Science Foundation , Materials Innovation Platform , Joan Redwing ,