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TSMC leads in advanced chip packaging wars, LexisNexis patent data says, ET Telecom

The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging technology for years, as Intel did not keep pace with its own filings. ....

South Korea , South Korean , Benjamin Ostapuk , Moonsoo Kang , Maxa Cherney , Marco Richter , Taiwan Semiconductor Manufacturing , Samsung Electronics , Semiconductor Manufacturing , Micro Device , Samsung Electronics , Advanced Micro Devices , Advanced Chip Packaging ,

TSMC Leads in Advanced Chip Packaging Patents, Outpacing Samsung and Intel

TSMC is emerging as the frontrunner in advanced chip packaging patents, surpassing its competitors Samsung Electronics and Intel ....

Moonsoo Kang , Marco Richter , Benjamin Ostapuk , Samsung Electronics , Taiwan Semiconductor Manufacturing Company , Nexis Patentsight Managing Director Marco Richter , Advanced Micro Devices ,

TSMC leads in advanced chip packaging wars, LexisNexis patent data says

Taiwanese chipmaker TSMC has
developed the most expansive arsenal of patents surrounding
advanced chip packaging, followed by Samsung Electronics
and then Intel, according to data from
LexisNexis.
. ....

South Korea , San Francisco , United States , South Korean , Moonsoo Kang , Matthew Lewis , Benjamin Ostapuk , Marco Richter , Maxa Cherney , Taiwan Semiconductor Manufacturing , Samsung Electronics , Semiconductor Manufacturing , Micro Device , San Francisco Editing ,

TSMC leads in advanced chip packaging wars, LexisNexis patent data says By Reuters

TSMC leads in advanced chip packaging wars, LexisNexis patent data says By Reuters
investing.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from investing.com Daily Mail and Mail on Sunday newspapers.

South Korea , South Korean , Maxa Cherney , Benjamin Ostapuk , Marco Richter , Moonsoo Kang , Samsung Electronics , Taiwan Semiconductor Manufacturing , Semiconductor Manufacturing , Micro Devices ,

TSMC leads in advanced chip packaging wars, LexisNexis patent data says

Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. Advanced chip packaging is a crucial technology that squeezes the most horsepower from the latest chip designs, and is crucial to chip contract manufacturers vying for business. The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging t ....

San Francisco , United States , South Korea , South Korean , Matthew Lewis , Benjamin Ostapuk , Moonsoo Kang , Maxa Cherney , Marco Richter , Taiwan Semiconductor Manufacturing , Samsung Electronics , Semiconductor Manufacturing , Micro Device ,