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TSMC leads in advanced chip packaging wars, LexisNexis patent data says, ET Telecom

The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging technology for years, as Intel did not keep pace with its own filings.

South koreaSouth koreanBenjamin ostapukMoonsoo kangMaxa cherneyMarco richterTaiwan semiconductor manufacturingSamsung electronicsSemiconductor manufacturingMicro deviceSamsung electronicsAdvanced micro devicesAdvanced chip packaging

TSMC Leads in Advanced Chip Packaging Patents, Outpacing Samsung and Intel

TSMC is emerging as the frontrunner in advanced chip packaging patents, surpassing its competitors Samsung Electronics and Intel

Moonsoo kangMarco richterBenjamin ostapukSamsung electronicsTaiwan semiconductor manufacturing companyNexis patentsight managing director marco richterAdvanced micro devices

TSMC leads in advanced chip packaging wars, LexisNexis patent data says

Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. .

South koreaSan franciscoUnited statesSouth koreanMoonsoo kangMatthew lewisBenjamin ostapukMarco richterMaxa cherneyTaiwan semiconductor manufacturingSamsung electronicsSemiconductor manufacturingMicro deviceSan francisco editing

TSMC leads in advanced chip packaging wars, LexisNexis patent data says By Reuters

TSMC leads in advanced chip packaging wars, LexisNexis patent data says By Reuters
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South koreaSouth koreanMaxa cherneyBenjamin ostapukMarco richterMoonsoo kangSamsung electronicsTaiwan semiconductor manufacturingSemiconductor manufacturingMicro devices

TSMC leads in advanced chip packaging wars, LexisNexis patent data says

Taiwanese chipmaker TSMC has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics and then Intel, according to data from LexisNexis. Advanced chip packaging is a crucial technology that squeezes the most horsepower from the latest chip designs, and is crucial to chip contract manufacturers vying for business. The data from LexisNexis, released last month, indicates that TSMC and Samsung have steadily invested in advanced packaging t

San franciscoUnited statesSouth koreaSouth koreanMatthew lewisBenjamin ostapukMoonsoo kangMaxa cherneyMarco richterTaiwan semiconductor manufacturingSamsung electronicsSemiconductor manufacturingMicro device