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New Electronics - Micron announces breakthrough in UFS packaging

Micron Technology is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution, delivered in what is said to be the world’s most compact UFS package at 9x13mms.

Micron Delivers the World's Most Compact UFS Package to Enable Next-Generation Phone Designs and Larger Batteries Seite 1

27.02.2024 - Company extends UFS 4.0 mobile storage leadership with proprietary firmware features to accelerate data-rich experiencesBARCELONA, Spain, Feb. 27, 2024 (GLOBE NEWSWIRE) - Mobile World Congress - Micron Technology, Inc. (Nasdaq: MU) announced today . Seite 1

Micron Collaborates with Samsung on Galaxy S24 Series to Unlock the Era of Mobile AI Experiences

Samsung’s flagship Galaxy S24 Ultra, S24+ and S24 incorporate Micron’s high-performance, power-efficient LPDDR5X and UFS 4.0BARCELONA, Spain, Feb. 27, 2024 Mobile World Congress – Micron.

Micron Collaborates With Samsung On Galaxy S24 Series To Unlock The Era Of Mobile AI Experiences

Micron Delivers the World's Most Compact UFS Package to Enable Next-Generation Phone Designs and Larger Batteries -February 27, 2024 at 02:03 am EST

Company extends UFS 4.0 mobile storage leadership with proprietary firmware features to accelerate data-rich experiencesBARCELONA, Spain, Feb. 27, 2024 Mobile World Congress  Micron.