Low Temperature Logic Technology News Today : Breaking News, Live Updates & Top Stories | Vimarsana

DARPA Initiates Low Temperature Integrated Circuits Project to Get Over Moore s Law Limitations
Our Bureau
507
The U.S. Defense Advanced Research Projects Agency (DARPA) has initiated a program to develop very low temperature device technology for defense applications, to overcome power efficiency limitations in high-performance computing currently guided by Moore’s law.
Moore s law states that the number of transistors on a computer chip that will double about every 18–24 months is slowing due to a host of technical challenges, including operating voltage reduction, making it difficult to continue with this paradigm.
“Today, we’re aggressively reaching the end of Moore’s Law scaling and are faced with the inability to scale power density much further in order to improve computing performance,” said Jason Woo, a program manager in DARPA’s Microsystems Technology Office (MTO). ....

Defense Advanced Research Projects Agency , Microsystems Technology Office , Toolbox Initiative , Temperature Logic Technology , Jason Woo , Technology Office , Low Temperature Logic Technology , மைக்ரோசிஸ்டம்ஸ் தொழில்நுட்பம் அலுவலகம் , கருவிப்பெட்டி முயற்சி , ஜேசன் வூ , தொழில்நுட்பம் அலுவலகம் ,