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DuPont's GreenTape LTCC based AiP can replace PCB antennas for 5G

DuPont Microcircuit and Component Materials (MCM) and ITRI in Taiwan are collaborating in bringing a new material GreenTape LTCC (Low Temperature Co-fired Ceramics) material to market for use in AiP (Antenna in Package) applications as an alternative to existing Print Circuit Board (PCB) options. ....

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DuPont Microcircuit and Component Materials Demonstrates Value of GreenTape™ LTCC in AiP Applications

SAN DIEGO, CA (PRWEB) May 04, 2022 DuPont (NYSE:DD) Microcircuit and Component Materials (MCM) is collaborating with Industrial Technology Research ....

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Global LTCC And HTCC Market Report 2022-2028 - Growth is Attributable to Rising Investments in Wireless Communication Technology

/PRNewswire/ The "LTCC And HTCC Market Size, Share & Trends Analysis Report by Product (LTCC, HTCC), by Application (Automotive, Telecommunication,. ....

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Global Low Temperature Co-fired Ceramics (LTCC) Market 2021 Key Players, Share, Trends, Sales, Segmentation and Forecast to 2026

Global Low Temperature Co-fired Ceramics (LTCC) Market 2021 Key Players, Share, Trends, Sales, Segmentation and Forecast to 2026
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