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Lithography System | Nikon Corp., Digital Solutions Business Unit | May 2023

The NSR-S625E argon fluoride (ArF) immersion scanner from Nikon Corp. is optimized for middle critical layers. The lithography system provides en ....

Nikon Corp , Nsr S625e , Argon Fluoride , Immersion Scanner , Lithography System , Asia Pacific ,

Nano-sized McGraw Tower features 161 steps, chimes


May 10, 2021
Twenty-four years ago, physics professor Harold Craighead and then-doctoral student Dustin Carr, Ph.D. ’00, created the world’s smallest guitar using cutting-edge technology in what was then the Cornell Nanofabrication Facility.
They’re at it again at the center – now known as the Cornell NanoScale Science and Technology Facility (CNF), in Duffield Hall. A team led by staff photolithographer Ed Camacho has created what is thought to be the world’s smallest rendition of Cornell’s iconic McGraw Tower – complete with its 161 interior steps, two sets of stairs and 21 bells.
Edward Camacho/Provided
Ed Camacho of the Cornell NanoScale Science and Technology Facility created a scale replica of Cornell’s iconic McGraw Tower. The model, just 1 millimeter tall, contains the tower’s 161 steps and chimes. ....

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Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems


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MELVILLE, N.Y., April 8, 2021 /PRNewswire/ Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for back-end process semiconductor lithography systems. This device features an i-line stepper
1 with a 1.5 micrometer
2 resolution and a wide exposure field of 52 mm x 68 mm for advanced packaging
3.
Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems
In the field of semiconductor chip performance enhancement, alongside the miniaturization of circuits in front-end process of semiconductor manufacturing, higher-density packaging in back-end processes has become a valuable resource within this market. Advanced packaging with high performance requires fine redistribution layer patterns ....

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