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Top News In Lihong Cao Today - Breaking & Trending Today

Fan-Out Packaging Gets Competitive

Fan-Out Packaging Gets Competitive
semiengineering.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from semiengineering.com Daily Mail and Mail on Sunday newspapers.

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Industry Spec Paves Way for Processors Built on Chiplets From Multiple Vendors

AMD, Intel, and Arm agree to use the new 'UCIe' specification to create processors that can combine chiplets from multiple vendors over a single unit. ....

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Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Advanced Semiconductor Engineering, Inc. (ASE), AMD, Arm, Google Cloud, Intel Corporation, Meta, Microsoft Corporation, Qualcomm Incorporated, Samsung, and Taiwan Semiconductor Manufacturing Company today announced the formation of an industry consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. ....

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Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem

Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
morningstar.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from morningstar.com Daily Mail and Mail on Sunday newspapers.

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Heavyweight UCIe Consortium Launched to Standardize Chiplet Ecosystem

A consortium of tech industry heavyweights today announced the Universal Chiplet Interconnect Express (UCIe) industry consortium with a mission to [.] ....

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