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Using Surface Characterization to Control Epoxy Die Bonding
This article describes the characterization of the epoxy die attachment process, its accuracy and its importance for stability. ....
Maria Osipova
,
Polytec Topmap
,
Flexible Electronics
,
Surface Characterization
,
Control Epoxy Die
,
Quad Flat No Leads
,
Line Thickness
,
Layer Thickness Measurement
,
Grid Array
,
Expoxy Die
,