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Scientists Develop Breakthrough Method for Slicing Diamonds Into Thin Wafers

Silicon-based materials are currently the undisputed leaders in the field of semiconductors. ....

Daijiro Tokunaga , Kosuke Sakamoto , Hirofumi Hidai , Laura Thomsonaug , School Of Engineering At Chiba University , Vehicle Battery Technology Industry , Professor At Tokyo Institute Of Technology , Vehicle Battery Technology , School Of Science , Engineering At Chiba University , Professor Hirofumi Hidai , Graduate School , Chiba University , Related Materials , Assistant Professor , Tokyo Institute , Vehicle Battery Technology Industry Focus ,

Novel Laser-Based Technique for Effortlessly Slicing Diamonds

Laser pulses have been utilized by the newly developed technique to slice diamonds into thin wafers, thereby setting the stage for its adoption as a next-generation semiconductor material. ....

Kosuke Sakamoto , Daijiro Tokunaga , Skyla Baily , Hirofumi Hidai , School Of Science , Engineering At Chiba University , Chiba University , Tokyo Institute Of Technology , School Of Engineering At Chiba University , Laser Based Technique , Effortlessly Slicing Diamonds , Professor Hirofumi Hidai , Graduate School , Related Materials , Assistant Professor , Tokyo Institute ,

A novel laser slicing technique for diamond semiconductors

A novel laser slicing technique for diamond semiconductors
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Daijiro Tokunaga , Hirofumi Hidai , Kosuke Sakamoto , School Of Science , Engineering At Chiba University , School Of Engineering At Chiba University , Chiba University , Professor At Tokyo Institute Of Technology , Professor Hirofumi Hidai , Graduate School , Related Materials , Assistant Professor , Tokyo Institute ,