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SK hynix invests $3.87 billion in new facility

Our selection of industry specific magazines cover a large range of topics. ....

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SK hynix signs investment agreement of advanced chip packaging

Our selection of industry specific magazines cover a large range of topics. ....

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SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
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SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue - High-Performance Computing News Analysis

Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D [.] ....

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SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

/PRNewswire/ SK hynix Inc. (or "the company", www.skhynix.com), the world s leading producer of High-Bandwidth Memory (HBM) chips, announced today that it. ....

Purdue University , United States , Soult Ukpyolsi , South Korea , State Of Indiana , West Lafayette , Republic Of Korea , Jeong Joon Yu , Junghan Kim , David Rosenberg , Arun Venkataraman , Choi Woojin , Mung Chiang , Lafayette Erin Easter , Kwak Noh Jung , States Hyundong Cho , Eric Holcomb , Todd Young , Purdue Research Park , Ivy Tech Community College , Technology Policy Arati Prabhakar , White House Office Of Science , Yongin Semiconductor Cluster , Purdue Birck Nanotechnology Center , Purdue Research Foundation Mitch Daniels , Purdue Research Foundation ,