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Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
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Joris Van Campenhout , Eric Beyne , Technology Conference ,

Imec WDM advance boosts wavelength channels 4x

A major advancement in silicon-based WDM (wavelength-division multiplexing) has been demo-ed using a 32-channel wavelength filter. ....

Imec Joris Van Campenhout , Joris Van Campenhout ,

OFC 2024: Trumpf, Optomind showcase 100Gbps VCSEL in 800Gbps transceiver…

OFC 2024: Trumpf, Optomind showcase 100Gbps VCSEL in 800Gbps transceiver…
optics.org - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from optics.org Daily Mail and Mail on Sunday newspapers.

San Diego , United States , Ralph Gudde , Joris Van Campenhout , Photonic Components , Optical Fiber Communication Conference , Chief Marketing Officer , Yung Son , Van Campenhout ,