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Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform

Thermal, stress and electronics cooling in-design analysis empowers designers to utilize ECAD and MCAD seamlessly for multiphysics simulation of electro-mechanical systems Convergence of FEM and CFD engines addresses thermal integrity challenges from the chip to the packaging, to the board and out through the complete electronic system Architected for massively parallel execution, Celsius Studio achieves up to 10X… ....

Michael Litchfield , Jeff Cain , Woopoung Kim , Ben Gu , Cadence Design Systems Inc , Samsung Semiconductor , Microwave Office , Samsung Device Solutions Research America , Celsius Studio , Cadence Design Systems , Future Facilities , Intelligent System Explorer , Design Analysis , Macro Modeling , Scale Simulation , Stage Analyses , System Level Thermal Analyses , Layout Suite , Implementation System , Optimality Intelligent System Explorer , Poung Kim , Advanced Packaging , Samsung Device Solutions Research , Technical Director ,

Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform

Cadence Significantly Advances ECAD/MCAD Convergence for Electronic Systems with New Celsius Studio AI Thermal Platform
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Ben Gu , Michael Litchfield , Jeff Cain , Woopoung Kim , Companies To Work , Samsung Device Solutions Research America , Cadence Design Systems Inc , Samsung Semiconductor , Microwave Office , Celsius Studio , Design Systems , Business Wire , Future Facilities , Cadence Optimality , Intelligent System Explorer , Design Analysis , Macro Modeling , Scale Simulation , Stage Analyses , System Level Thermal Analyses , Layout Suite , Implementation System , Optimality Intelligent System Explorer , Poung Kim , Advanced Packaging , Samsung Device Solutions Research ,

Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference

SAN JOSE, Calif., December 20, 2023 Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Wistron, a leading technical service provider (TSP), has adopted and deployed the new AI-driven electromagnetic (EM) in-design analysis workflow, including the Cadence® Optimality™ Intelligent System Explorer and the Cadence Clarity™ 3D Solver, to design a complex 800G network switch. Using the Optimality Explorer’s AI-driven optimization technology and the… ....

Ben Gu , Christopher Huang , Cadence Design Systems Inc , Networking Business Group At Wistron , Multiphysics System Analysis Group At Cadence , Cadence Design Systems , Intelligent System Explorer , Optimality Explorer , Networking Business Group , Multiphysics System Analysis Group , Intelligent System ,

Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development

Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
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Christopher Huang , Ben Gu , Networking Business Group At Wistron , Cadence Design Systems Inc , Multiphysics System Analysis Group At Cadence , Companies To Work , Optimality Intelligent System Explorer , Design Systems , Intelligent System Explorer , Cadence Clarity , Optimality Explorer , Networking Business Group , Multiphysics System Analysis Group , Intelligent System Design , Cadence Design Systems ,

Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development

Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
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