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Extending Moore's Law: CEA-Leti & Intel to develop atomically thin 2D TMDs on 300mm wafers – CIE

Extending Moore's Law: CEA-Leti & Intel to develop atomically thin 2D TMDs on 300mm wafers – CIE
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Robert Chau , Sebastien Dauv , Intel Europe Research , Intel Senior Fellow In Technology Development , Intel Senior Fellow , Technology Development , Mintel Europe ,

New Electronics - CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers

New Electronics - CEA-Leti and Intel to develop atomically thin 2D TMDs on 300mm wafers
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Robert Chau , Sebastien Dauv , Intel Senior Fellow In Technology Development , Intel Europe Research , Intel Senior Fellow , Technology Development , Mintel Europe ,

CEA-Leti and Intel to Develop 2D TMDs on 300mm Wafers Using Layer Transfer Tech for Future Transistor Scaling

CEA-Leti and Intel to Develop 2D TMDs on 300mm Wafers Using Layer Transfer Tech for Future Transistor Scaling
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Robert Chau , Sebastien Dauv , Intel Senior Fellow In Technology Development , Intel Europe Research , Intel Senior Fellow , Technology Development , Mintel Europe ,