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Florida Tech Holds Spring Commencement May 4 - Florida Tech News

The more than 1,700 graduating students represent a remarkable 73 countries and all 50 U.S. states, from Alaska to West Virginia.

United-states
Melbourne
Victoria
Australia
Alaska
Florida
American
Joan-higginbotham
Georgew-bush
John-nicklow
Lowe-companies-inc
Capsule-communicator-branch

Korean Scientists Develop Novel "Bone Bandage" Material for Cracked Bones – FocusTechnica

Korean Scientists Develop Novel "Bone Bandage" Material for Cracked Bones – FocusTechnica
focustechnica.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from focustechnica.com Daily Mail and Mail on Sunday newspapers.

South-korea
Daejeon
Taejon-gwangyoksi
Sunho
Kyongsang-bukto
Korea
Yonghyun-gwon
Soyeon-kim
Soyun-joo
Seungbum-hong
Jangho-kim
Daedeok-innopolis

Tomahawk's Chops: xGM-109 Block IV Cruise Missiles - Defense Industry Daily

Tomahawk's Chops: xGM-109 Block IV Cruise Missiles - Defense Industry Daily
defenseindustrydaily.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from defenseindustrydaily.com Daily Mail and Mail on Sunday newspapers.

Springfield
California
United-states
Middletown
Wakefield
United-kingdom
Washington
Yemen
Canada
Japan
Virginia
Georgia

New institute accelerates future of microelectronic system integration, advanced packaging

New institute accelerates future of microelectronic system integration, advanced packaging
purdue.edu - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from purdue.edu Daily Mail and Mail on Sunday newspapers.

Osaka
Japan
Indiana
United-states
Belgium
Purdue-university
West-lafayette
Purdue-jamesg-dwyer
Mark-lundstrom
Nikhilesh-chawla
Dave-henshall
Mitchelle-daniels-jr

Purdue collaborates to bolster rapid technology development in U.S.

WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda .

Japan
Belgium
Purdue-university
Indiana
United-states
Osaka
Todd-younkin
Tom-beckley
Ganesh-subbarayan
Mark-lundstrom
Luc-van
Dave-henshall

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