TSMC s Advanced Backend Fab 6, the foundry s first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration, has opened.
The recent partnership between STMicroelectronics and China-based Sanan Optoelectronics is the latest case showing the European automotive supply chain is striving to gain a presence for its SiC devices in China.
Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in its joint venture XSemi with Foxconn Electronics (Hon Hai Technology Group) to maximize the resources invested, said president of Tong Hsing and XSemi CS Chang during a recent company investor conference.
DRAM contract prices are likely to bottom out in the third quarter of 2023 while the NAND flash segment will reach the lowest point in the fourth quarter, according to memory module company Adata Technology.