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Photonics21: European photonics industry growing at more than double global GDP rate, new analysis finds

New research published today shows European photonics is growing at more than double the rate of global GDP – outperforming EU GDP and EU industrial production by three and five times, respectively. Present in many high-end, next-generation products, photonics technologies have proved to be long-term drivers of growth through their indispensable role in future markets.

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microLED ICs fabbed on 300mm wafers

microLED ICs fabbed on 300mm wafers Eight year-old Leti micro-LED spin-off Aledia has manufactured microLED ICs on 300mm (12”) silicon wafers. The company, which developed its technology on 200mm (8”) silicon wafers over the past eight years. “The larger size allows 60-100 smartphone displays to be made on a single 300mm wafer, versus approximately four-to-six using the present LED industry-standard, 4” sapphire substrate,” says Akedia CEO Giorgio Anania, “thanks to Aledia’s unique nanowire LED technology (3D LED), this can be done with commercially available processes and equipment, since it uses standard-thickness (780µm) silicon wafers.” Planar, “2D” microLEDs are produced by depositing flat layers of  GaN crystal on sapphire wafers of 100-150mm diameter (4-6”), with the majority of production today being on 100mm (4”) wafers. Aledia’s microLED technology grows GaN nanowires (GaN crystals of sub-micron diameter) on top of large-area silicon deliver

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Aledia produces first nanowire chips on 300mm silicon wafers

Aledia produces first nanowire chips on 300mm silicon wafers Aledia, a French start-up developing a disruptive technology for microLED displays, has manufactured the world’s first microLED chips produced on 300mm (12”) silicon wafers. The company, which developed its technology on 200mm (8”) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. The larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. Aledia was spun out of CEA-Leti, a French research institute pioneering micro- and nanotechnologies, in 2012, and the work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams.

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Aledia produces its first nanowire chips on 300mm Si wafers

Aledia produces its first nanowire chips on 300mm silicon wafers 16 Dec 2020 After several years in stealth mode, French developer of microLED displays is now using CEA-Leti pilot lines. The company, which has been developing its technology on 200mm (8in) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. Aledia says that the larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. In 2012, the company was spun out of French research institute CEA-Leti, which develops micro- and nanotechnologies. The work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams.

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Nanotechnology Now - Press Release: Aledia, French Developer of Next-Generation MicroLED Displays For High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines: Company will produce microLEDs on both 200mm and 300mm silicon wafers

Our NanoNews Digest Sponsors Home > Press > Aledia, French Developer of Next-Generation MicroLED Displays For High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines: Company will produce microLEDs on both 200mm and 300mm silicon wafers Abstract: Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the world’s first microLED chips produced on 300mm (12”) silicon wafers. The company, which developed its breakthrough technology on 200mm (8”) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. The larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. Aledia was spun out of CEA-Leti, a French research institute pioneering micro- and nanotechnologies, in 2012, and the work on 300mm wafers has been

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