Aledia produces its first nanowire chips on 300mm silicon wafers
16 Dec 2020
After several years in stealth mode, French developer of microLED displays is now using CEA-Leti pilot lines.
The company, which has been developing its technology on 200mm (8in) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers.
Aledia says that the larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. In 2012, the company was spun out of French research institute CEA-Leti, which develops micro- and nanotechnologies. The work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams.