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CEVA buys chiplet specialist

CEVA buys chiplet specialist CEVA is to buy Intrinsix of Massachusetts for approximately $33 million in cash. Combining Intrinsix’s chip design capabilities and IP with CEVA’s wireless connectivity and smart sensing IP enables a comprehensive IP platform. For nearly 35 years, Intrinsix has been providing SoC design expertise in the areas of RF, mixed signal, digital, software, secure processors and interface IP for Heterogenous SoCs (HSoCs), otherwise referred to as chiplets. With more than 1,500 designs with a customer base that includes Intel, IBM, Leidos and Lockheed Martin, Intrinsix commands a strong foothold in aerospace & defense, a market that is estimated to reach $6 billion in semiconductor spending in 2022. Intrinsix is also involved in the development of chiplets and secure processors for DARPA projects.

Gideon wertheizerUs department of defenseLockheed martinCombining intrinsixHeterogenous socsஎங்களுக்கு துறை ஆஃப் பாதுகாப்புலாக்ஹீட் மார்டின்

CEVA to Acquire Intrinsix Corp , Expanding its Offering to Include Full Turnkey IP Platforms

Share this article Share this article ROCKVILLE, Md., May 10, 2021 /PRNewswire/ CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that it agreed to acquire Massachusetts-based Intrinsix Corp., a leading chip design specialist, for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is anticipated to take place during the second quarter of 2021. The combination of Intrinsix s broad chip design capabilities and IP together with CEVA s leading-edge wireless connectivity and smart sensing IP enables a unique proposition of a full turnkey IP platform that lowers entry barriers for OEMs, IT companies and Tier 1s considering the development of their own advanced chips in market verticals such as 5G infrastructure, automotive, aerospace & defense, medical, robotics and Industrial IoT (IIOT).

Gideon wertheizerJim gobesUs department of defenseMirus securities incIntrinsix corpInternational participantsSource ceva incPrnewswire ceva incCeva incLockheed martinMassachusetts based intrinsix corpIndustrial iotHeterogenous socsAccess codeDigital signal processorsHillcrest labs

CEVA Inc (CEVA) Q1 2021 Earnings Call Transcript

[Operator Instructions] [Operator Instructions] I would now like to turn the conference over to Richard Kingston, Vice President of Market Intelligence, Investor and Public Relations. Please go ahead, sir. Richard Kingston Vice President of Market Intelligence, Investor & Public Relations Thank you, Rocco. Good morning everyone and welcome to CEVA s first quarter 2021 earnings conference call. I m joined today by Gideon Wertheizer, Chief Executive Officer, and Yaniv Arieli, Chief Financial Officer of CEVA. Gideon will cover the business aspects and the highlights from the first quarter and provide general qualitative data. Yaniv will then cover the financial results for the first quarter and also provide qualitative data for the second quarter and full-year 2021.

United statesYaniv arieliSuji desilvaDavid oconnor exaneMatt ramsayMartin yangTavy rosnerMatthewd ramsay cowenGideon wertheizerSuji desilva rothPeter zdebski barclaysRichard kingstonPeter zdebskiDavid oconnorMartin yang oppenheimerIsraeli innovation authority

CEVA, Inc (NASDAQ:CEVA) - CEVA Shares Fall After Q1 Earnings Miss, Licensing Revenue Decline

CEVA, Inc (NASDAQ:CEVA) - CEVA Shares Fall After Q1 Earnings Miss, Licensing Revenue Decline
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Ceva acquires US chip design co Intrinsix

Ceva acquires US chip design co Intrinsix Intrinsix provides complex System-on-Chip (SoC) design expertise. Israeli wireless connectivity and smart sensing technologies licensor Ceva Inc. (Nasdaq:CEVA) today announced that it has agreed to acquire Massachusetts-based chip design specialist Intrinsix Corp., for approximately $33 million in cash, subject to working capital and other customary purchase price adjustments. The closing of the acquisition is scheduled to take place in the second quarter of 2021. Ceva said that the combination of Intrinsix s broad chip design capabilities and IP together with its own leading-edge wireless connectivity and smart sensing IP enables a unique proposition of a full turnkey IP platform that lowers entry barriers for OEMs, IT companies and Tier 1s considering the development of their own advanced chips in market verticals such as 5G infrastructure, automotive, aerospace and defense, medical, robotics and Industrial IoT (IIOT).

United statesGideon wertheizerJim gobesUs department of defenseIntrinsix corpCeva incLockheed martinIndustrial iotHeterogenous socsஒன்றுபட்டது மாநிலங்களில்எங்களுக்கு துறை ஆஃப் பாதுகாப்புசிஇவிஏ இன்க்லாக்ஹீட் மார்டின்தொழில்துறை ஈயொட்