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Samsung announces next-gen HBM4 memory: higher capacity, speeds, 3D packaging tech

Samsung confirms next-gen HBM4 memory is in development, should include 16-Hi stacks that will offer up to 256GB of HBM4 memory for future AI GPUs.

South koreaSouth koreanJim kellerSamsung electronicsAmsung hbm4Bm4 memoryExt gen hbm4Amsung hbm4 memoryAi gpuAmd tsmc200 ai gpuK hynix

SK hynix and TSMC to work together with HBM4 and next-gen semiconductor packaging technology

SK hynix partners with TSMC to strengthen HBM technological leadership, will work together on next-gen HBM4 and next-gen advanced packaging technology.

South koreaSouth koreanThrough silicon viaSk hynixTaiwan semiconductor manufacturing companyK hynix tsmcExt gen hbm4Ai gpuHi memoryK hynix hbm4

Samsung announces it has manufactured a sample of 16-stack HBM for AI GPUs

Samsung announces it has manufactured a sample of 16-stack HBM, talks about next-gen HBM4 which will sample in 2025, go into mass production in 2026.

South koreaSouth koreanKim dae wooK hynix6 layer hbm6 stack hbmExt gen hbm4

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